glossary:glossary_h
Differences
This shows you the differences between two versions of the page.
Both sides previous revisionPrevious revision | |||
glossary:glossary_h [2020/05/08 00:18] – Clarify definitions and fix typos. Add Hysteresis term focused on electronics application. H0 is not HO. tgerbic | glossary:glossary_h [2021/08/08 04:50] (current) – updated the wikipedia link Wayne | ||
---|---|---|---|
Line 31: | Line 31: | ||
HASL, or Hot Air Solder Leveling, is a process of coating the bare copper of an etched PCB with something like solder or varnish (solder mask). This keeps the PCB traces from oxidising over time, which makes the traces harder to solder to. | HASL, or Hot Air Solder Leveling, is a process of coating the bare copper of an etched PCB with something like solder or varnish (solder mask). This keeps the PCB traces from oxidising over time, which makes the traces harder to solder to. | ||
The standard HASL provided by Chinese manufacturers is leaded solder. More expensive options are lead free solder, organic solderable varnish stuff, nickel, or gold flash.\\ | The standard HASL provided by Chinese manufacturers is leaded solder. More expensive options are lead free solder, organic solderable varnish stuff, nickel, or gold flash.\\ | ||
- | [[https:// | + | [[wp>Hot_air_solder_leveling|Hot Air Solder Leveling]]\\ |
| | ||
===== Header plug or socket ===== | ===== Header plug or socket ===== |
glossary/glossary_h.txt · Last modified: 2021/08/08 04:50 by Wayne